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LTM4607
APPLICATIONS INFORMATION
Table 3. Typical Components (? = 400kHz)
V IN
(V)
36
5
12
32
36
V OUT
(V)
20
24
24
24
24
R SENSE
(0.5W RATING)
1 × 13mΩ 0.5W
2 × 16mΩ 0.5W
2 × 18mΩ 0.5W
1 × 14mΩ 0.5W
1 × 13mΩ 0.5W
Inductor
(μH)
8
3.3
4.7
4.7
7
C IN
(CERAMIC)
2 × 10μF 50V
None
None
2 × 10μF 50V
2 × 10μF 50V
C IN
(BULK)
150μF 50V
150μF 50V
150μF 50V
150μF 50V
150μF 50V
C OUT1
(CERAMIC)
2 × 22μF 25V
4 × 22μF 25V
4 × 22μF 25V
2 × 22μF 25V
2 × 22μF 25V
C OUT2
(BULK)
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
2 × 150μF 50V
I OUT(MAX) *
(A)
8
2
5
8
8
INDUCTOR MANUFACTURER
Sumida
Toko
SENSING RESISTOR MANUFACTURER
Panasonic
KOA
Vishay
WEBSITE
www.sumida.com
www.toko.com
WEBSITE
www.panasonic.com/industrial/components
www.koaspeer.com
www.vishay.com
PHONE NUMBER
408-321-9660
847-297-0070
PHONE NUMBER
949-462-1816
814-362-5536
800-433-5700
*Maximum load current is based on the Linear Technology DC1198A at room temperature with natural convection. Poor board layout design may
decrease the maximum load current.
Table 4. Boost Mode
DERATING CURVE
Figure 7, 9
Figure 7, 9
Figure 7, 9
Figure 8, 10
Figure 8, 10
Figure 8, 10
V OUT (V)
12, 16
12, 16
12, 16
12, 16
12, 16
12, 16
POWER LOSS CURVE
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
AIR FLOW (LFM)
0
200
400
0
200
400
HEAT SINK
None
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
θ JA (°C/W)*
11.4
8.5
7.5
11.0
7.9
7.1
Table 5. Buck Mode
DERATING CURVE
Figure 11, 13
Figure 11, 13
Figure 11, 13
Figure 12, 14
Figure 12, 14
Figure 12, 14
V OUT (V)
12, 20
12, 20
12, 20
12, 20
12, 20
12, 20
POWER LOSS CURVE
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
AIR FLOW (LFM)
0
200
400
0
200
400
HEAT SINK
None
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
θ JA (°C/W)*
8.2
5.9
5.4
7.5
5.3
4.8
HEAT SINK MANUFACTURER
Wakefield Engineering
Aavid Thermalloy
PART NUMBER
LTN20069
375424B00034G
PHONE NUMBER
603-635-2800
603-224-9988
*The results of thermal resistance from junction to ambient θ JA are based on the demo board DC 1198A. Thus, the maximum temperature on board is treated
as the junction temperature (which is in the μModule for most cases) and the power losses from all components are counted for calculations. It has to be
mentioned that poor board design may increase the θ JA .
17
For more information www.linear.com/LTM4607
4607fc
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